With the gradual development of consumer electronics products towards lighter, thinner, more intelligent applications, display technology, data transfer machine processing capabilities put forward higher requirements, the diversification of uses and volume of thin and light also prompted the printed circuit board in a limited area to arrange more wires, and constantly to the line width of thin, dense wiring, process precision and other ultra-fine direction, high-density, thin, flexible, rigid-flexible combination and environmentally friendly production gradually become the direction of future development.
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